Merge branch 'master' of https://gitea.sharpe6.com/Adog64/Rowan-Classes
This commit is contained in:
commit
29767107a1
22
8th-Semester-Spring-2025/biology/term-project/references.bib
Normal file
22
8th-Semester-Spring-2025/biology/term-project/references.bib
Normal file
@ -0,0 +1,22 @@
|
||||
@article{elias2008,
|
||||
author = {Elias, Hans and Bengelsdorf, Herbert},
|
||||
title = {THE STRUCTURE OF THE LIVER OF VERTEBRATES},
|
||||
journal = {Acta Anatomica},
|
||||
volume = {14},
|
||||
number = {4},
|
||||
pages = {297-337},
|
||||
year = {2008},
|
||||
month = {06},
|
||||
issn = {0001-5180},
|
||||
doi = {10.1159/000140715},
|
||||
url = {https://doi.org/10.1159/000140715},
|
||||
eprint = {https://karger.com/aan/article-pdf/14/4/297/2113559/000140715.pdf},
|
||||
}
|
||||
|
||||
@book{pandol2011,
|
||||
title = {The Exocrine Pancreas},
|
||||
author = {Pandol, Stephen J.},
|
||||
year = {2011},
|
||||
doi = {https://doi.org/10.4199/C00026ED1V01Y201102ISP014},
|
||||
publisher = {Morgan & Claypool}
|
||||
}
|
||||
BIN
8th-Semester-Spring-2025/biology/week-10/Meiosis_MHC.pdf
Normal file
BIN
8th-Semester-Spring-2025/biology/week-10/Meiosis_MHC.pdf
Normal file
Binary file not shown.
BIN
8th-Semester-Spring-2025/biology/week-10/Mitosis_MHC.pdf
Normal file
BIN
8th-Semester-Spring-2025/biology/week-10/Mitosis_MHC.pdf
Normal file
Binary file not shown.
Binary file not shown.
|
After Width: | Height: | Size: 31 KiB |
Binary file not shown.
|
After Width: | Height: | Size: 41 KiB |
@ -0,0 +1,34 @@
|
||||
---
|
||||
title: BIOL01113 Pre-Lab Project 10
|
||||
author: Aidan Sharpe
|
||||
date: April 7th 2025
|
||||
geometry: margin=1in
|
||||
---
|
||||
|
||||
# Male Reproductive System
|
||||
|
||||
|
||||
1. Urine Bladder
|
||||
2. Pubic Bone
|
||||
3. Vas Deferens
|
||||
4. Urethra
|
||||
5. Erectile Tissue
|
||||
6. Penis
|
||||
7. Seminal Vesicle
|
||||
8. Prostate Gland
|
||||
9. Anus
|
||||
10. Epididymis
|
||||
11. Scrotum
|
||||
12. Testis
|
||||
|
||||
# Female Reproductive System
|
||||
|
||||
|
||||
1. Ovary
|
||||
2. Fallopian Tubes
|
||||
3. Uterus
|
||||
4. Urine Bladder
|
||||
5. Urethra
|
||||
6. Vagina
|
||||
7. Cervix
|
||||
8. Rectum
|
||||
Binary file not shown.
Binary file not shown.
Binary file not shown.
Binary file not shown.
@ -0,0 +1,36 @@
|
||||
---
|
||||
title: BIOL01113 Vocabulary Assignment 11
|
||||
author: Aidan Sharpe
|
||||
date: April 14th, 2025
|
||||
geometry: margin=1in
|
||||
---
|
||||
|
||||
## Chromatin
|
||||
A network of fine threads comprised of DNA and proeins.
|
||||
|
||||
## Semiconservative replication
|
||||
The synthesis of new DNA where half of each new strand of DNA is from the original strand.
|
||||
|
||||
## DNA polymerase
|
||||
An enzyme responsible for the positioning and joining of new nucleotides onto a template strand of DNA.
|
||||
|
||||
## Homologous chromosomes
|
||||
Two chromosomes that code for the same traits.
|
||||
|
||||
## Diploid
|
||||
A cell containing two sets of chromosomes
|
||||
|
||||
## Mitosis
|
||||
A type of cell division that produces diploid daughter cells
|
||||
|
||||
## Cell cycle
|
||||
The repeating process of interphase, mitosis, and cytokinesis.
|
||||
|
||||
## Gametogenesis
|
||||
The production of new gametes (sperm and oocytes).
|
||||
|
||||
## Meiosis
|
||||
A type of cell division that produces haploid daughter cells
|
||||
|
||||
## Haploid
|
||||
A cell containing only one set of chromosomes
|
||||
Binary file not shown.
@ -0,0 +1,105 @@
|
||||
---
|
||||
title: Management of Your Consulting Project/Contract
|
||||
---
|
||||
|
||||
# Project Planning
|
||||
$400 before record for taxation
|
||||
|
||||
## Project vs. Program
|
||||
#### Project
|
||||
A temporary task undertaken to create a unique product or service
|
||||
|
||||
#### Program
|
||||
A series of projects that are managed in a coordinated way (longer term)
|
||||
|
||||
#### Project management is a process:
|
||||
- **Initiate:** conceptualize the idea or task
|
||||
- **Plan:** how will you actually complete the task
|
||||
- **Execute:** do the plan
|
||||
- **Control:**
|
||||
- **Close:**
|
||||
|
||||
## Project Initiation
|
||||
How does your project get started?
|
||||
|
||||
- Formal response to request for proposal (RFP)
|
||||
- Informal request to tackle a project
|
||||
- Cold call
|
||||
|
||||
- **Mission:** why are you taking on the project
|
||||
- **Objective:** what are the goals of the project
|
||||
- **Deliverables:** what outcomes constitute completion
|
||||
- **Client/Customer:** who has interest in the project
|
||||
|
||||
## Project Planning
|
||||
### Areas to cover:
|
||||
- Scope of project/tasks
|
||||
- Time requirements
|
||||
- Cost discussion
|
||||
- Known issues that need to be addressed
|
||||
- Risk management
|
||||
- Quality control requirements
|
||||
- Communications
|
||||
- Resource requirements
|
||||
|
||||
### Helpful Artifacts
|
||||
- Work breakdown structure (WBS)
|
||||
- Project budget
|
||||
- Bill of Materials (BOM)
|
||||
- Project schedule
|
||||
- Start and end dates
|
||||
- How to fill in everything in between
|
||||
- Major milestones
|
||||
- Responsibility assignment matrix (RAM)
|
||||
- Configuration change control process
|
||||
- Know the cost of making a change
|
||||
- Risk management plan
|
||||
|
||||
## Project execution
|
||||
How do you know if you are ahead or behind schedule?
|
||||
|
||||
- Schedule tracking and status
|
||||
- All planned tasks should be incorporated into some form of a schedule
|
||||
- Advises number of resources and how to adjust if necessary
|
||||
- Measure Project Activities
|
||||
- Amount of effort over time
|
||||
- What happened or is happening?
|
||||
- Report progress to client/customer
|
||||
|
||||
# Work Breakdown Structure
|
||||
A product-oriented "family tree" division of hardware, software, services, and other work products which organizes graphically.
|
||||
|
||||
- Hierarchical breakdown of products and services
|
||||
- All products and services required to complete the project
|
||||
- Consulting likely won't get to this level of detail
|
||||
|
||||
- Budget
|
||||
- Master schedule
|
||||
- Organization
|
||||
- Contract Tasking
|
||||
- Risk management
|
||||
- Reporting
|
||||
|
||||
# Change Management
|
||||
Depends on risk of change for each requirement.
|
||||
|
||||
# Project Status Reporting
|
||||
Can be formal or informal, but ultimately up to the client or customer.
|
||||
|
||||
- Informal tends to allow more open and honest communication
|
||||
- Still need actual metrics
|
||||
|
||||
### How often to report status
|
||||
- Monthly is too infrequent
|
||||
- Daily can make it hard to assess and react
|
||||
- Weekly tends to be about right
|
||||
|
||||
### Acceptance
|
||||
- Fully define some level of acceptance
|
||||
- How do you know when the product is acceptable
|
||||
- Clear criteria doesn't always exist
|
||||
|
||||
### Approval
|
||||
- Who approves the project deliverables?
|
||||
- When is a project approved?
|
||||
- May require your client to seek approval if you are a sub-contractor
|
||||
Binary file not shown.
Binary file not shown.
@ -0,0 +1,111 @@
|
||||
Designator,Comment,Layer,Footprint,Center-X(mm),Center-Y(mm),Rotation,Description,Manufacturer part number,Manufacturer_Part_Number,Mounting Technology
|
||||
ST3,PTH-M3D6.5X6.5,TopLayer,PTH-M3D6.5X6.5,5.08,5.08,0,"M3 PTH (3.5mm), 6.5mm pad",,,TH
|
||||
ST2,PTH-M3D6.5X6.5,TopLayer,PTH-M3D6.5X6.5,5.08,85.09,0,"M3 PTH (3.5mm), 6.5mm pad",,,TH
|
||||
ST1,PTH-M3D6.5X6.5,TopLayer,PTH-M3D6.5X6.5,93.98,85.09,0,"M3 PTH (3.5mm), 6.5mm pad",,,TH
|
||||
FD3,FID1X2R,TopLayer,FID1X2R,90.17,13.335,90,Fiducial - Round 1x2mm,,,SMT
|
||||
FD2,FID1X2R,TopLayer,FID1X2R,9.525,10.795,90,Fiducial - Round 1x2mm,,,SMT
|
||||
FD1,FID1X2R,TopLayer,FID1X2R,71.755,77.47,0,Fiducial - Round 1x2mm,,,SMT
|
||||
R18_MS,10 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,47.706,27.162,180,"10 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-0710KL,,SMT
|
||||
R18_HM,10 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,26.513,27.146,180,"10 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-0710KL,,SMT
|
||||
R17_MS,1 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,47.691,28.813,180,"1 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-071KL,,SMT
|
||||
R17_HM,1 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,26.498,28.797,180,"1 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-071KL,,SMT
|
||||
R16_MS,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,48.006,50.531,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R16_HM,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,26.813,50.515,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
Q1_MS,"2N7002,215",TopLayer,NXP-SOT23-3_V,48.006,31.623,90,"N-channel Trench MOSFET, 60 V, 300 mA, -65 to 150 degC, 3-Pin SOT-23 (TO-236AB), RoHS, Tape and Reel",,,SM
|
||||
Q1_HM,"2N7002,215",TopLayer,NXP-SOT23-3_V,26.813,31.607,90,"N-channel Trench MOSFET, 60 V, 300 mA, -65 to 150 degC, 3-Pin SOT-23 (TO-236AB), RoHS, Tape and Reel",,,SM
|
||||
DS2_MS,TLMS1100-GS08,TopLayer,VISH-TLMX1100_V,48.006,40.64,270,"Red Led, 20mA, 2.1 V, -40 to 100 degC, 2-Pin SMD (0603), RoHS, Tape and Reel",,,SM
|
||||
DS2_HM,TLMS1100-GS08,TopLayer,VISH-TLMX1100_V,26.813,40.624,270,"Red Led, 20mA, 2.1 V, -40 to 100 degC, 2-Pin SMD (0603), RoHS, Tape and Reel",,,SM
|
||||
DS1_MS,TLMS1100-GS08,TopLayer,VISH-TLMX1100_V,48.006,45.847,270,"Red Led, 20mA, 2.1 V, -40 to 100 degC, 2-Pin SMD (0603), RoHS, Tape and Reel",,,SM
|
||||
DS1_HM,TLMS1100-GS08,TopLayer,VISH-TLMX1100_V,26.813,45.831,270,"Red Led, 20mA, 2.1 V, -40 to 100 degC, 2-Pin SMD (0603), RoHS, Tape and Reel",,,SM
|
||||
B2,92-AA,BottomLayer,92-AA,69.3579,8.509,180,AA Battery Holder,,92,THT
|
||||
U3_1M,INND-TS30,TopLayer,INND-TS30,42.164,43.307,0,,,,
|
||||
R15_MB,1 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,30.948,17.369,270,"1 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-071KL,,SMT
|
||||
R15_HB,1 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,9.323,17.406,270,"1 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-071KL,,SMT
|
||||
U4,NE555DR,TopLayer,D0008A_N,76.904,80.518,0,"Precision Timer, 4.5 to 16 V, 0 to 70 degC, 8-Pin SOIC (D), Green (RoHS & no Sb/Br), Tape and Reel",NE555DR,,SM
|
||||
U3_10S,INND-TS30,TopLayer,INND-TS30,53.848,43.307,0,,,,
|
||||
U3_10M,INND-TS30,TopLayer,INND-TS30,32.639,43.307,0,,,,
|
||||
U3_10H,INND-TS30,TopLayer,INND-TS30,11.176,43.307,0,,,,
|
||||
U3_1S,INND-TS30,TopLayer,INND-TS30,63.373,43.307,0,,,,
|
||||
U3_1H,INND-TS30,TopLayer,INND-TS30,20.701,43.307,0,,,,
|
||||
U2_10S,CD4026BE,TopLayer,N0016A,53.721,71.501,0,"Display Driver Counter, 4000/14000/40000 Series, Synchronous, Positive Edge Triggered, 5-Bit, Up Direction, CMOS, PDIP16",,,THT
|
||||
U2_10M,CD4026BE,TopLayer,N0016A,32.512,71.501,0,"Display Driver Counter, 4000/14000/40000 Series, Synchronous, Positive Edge Triggered, 5-Bit, Up Direction, CMOS, PDIP16",,,THT
|
||||
U2_10H,CD4026BE,TopLayer,N0016A,11.049,71.501,0,"Display Driver Counter, 4000/14000/40000 Series, Synchronous, Positive Edge Triggered, 5-Bit, Up Direction, CMOS, PDIP16",,,THT
|
||||
U2_1S,CD4026BE,TopLayer,N0016A,63.246,71.501,0,"Display Driver Counter, 4000/14000/40000 Series, Synchronous, Positive Edge Triggered, 5-Bit, Up Direction, CMOS, PDIP16",,,THT
|
||||
U2_1M,CD4026BE,TopLayer,N0016A,42.037,71.501,0,"Display Driver Counter, 4000/14000/40000 Series, Synchronous, Positive Edge Triggered, 5-Bit, Up Direction, CMOS, PDIP16",,,THT
|
||||
U2_1H,CD4026BE,TopLayer,N0016A,20.574,71.501,0,"Display Driver Counter, 4000/14000/40000 Series, Synchronous, Positive Edge Triggered, 5-Bit, Up Direction, CMOS, PDIP16",,,THT
|
||||
U1,CD4073BE,TopLayer,N0014A,82.804,64.897,0,"AND Gate, 4000/14000/40000 Series, 3-Func, 3-Input, CMOS, PDIP14",,,THT
|
||||
TP3,5003,TopLayer,KSTN-5003,53.34,85.725,0,"Test Point, Orange, Height 4.6 mm, Tail Length 3 mm, 1-Pin THD, RoHS",,,TH
|
||||
TP2,5003,TopLayer,KSTN-5003,49.657,85.725,0,"Test Point, Orange, Height 4.6 mm, Tail Length 3 mm, 1-Pin THD, RoHS",,,TH
|
||||
TP1,5003,TopLayer,KSTN-5003,65.405,85.725,0,"Test Point, Orange, Height 4.6 mm, Tail Length 3 mm, 1-Pin THD, RoHS",,,TH
|
||||
SW1_HB,B3F-1000,TopLayer,OMRON-B3F-1000-4_V,15.546,19.086,0,"Tactile Switch, SPST-NO, 0.05 A, 24 V, -25 to 70 degC, 4-Pin THD, RoHS, Bulk",,,TH
|
||||
SW1_MB,B3F-1000,TopLayer,OMRON-B3F-1000-4_V,37.171,19.049,0,"Tactile Switch, SPST-NO, 0.05 A, 24 V, -25 to 70 degC, 4-Pin THD, RoHS, Bulk",,,TH
|
||||
R14,3362P-1-104LF,TopLayer,BOUR-3362P,85.0333,81.203,0,"Square Trimpot(R) Trimming Potentiometer, 100 KOhm, 300 V, -55 to 125 degC, 3-Pin THD, RoHS, Tube",,,TH
|
||||
R13,1 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,85.6683,84.597,0,"1 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-071KL,,SMT
|
||||
R12_HB,10 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,5.513,17.406,90,"10 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-0710KL,,SMT
|
||||
R12_MB,10 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,27.138,17.369,90,"10 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-0710KL,,SMT
|
||||
R11_10S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,56.896,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R11_10M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,35.687,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R11_10H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,14.224,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R11_1S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,66.421,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R11_1M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,45.212,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R11_1H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,23.749,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R10_10S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,52.705,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R10_10M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,31.496,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R10_10H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,10.033,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R10_1S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,62.23,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R10_1M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,41.021,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R10_1H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,19.558,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R9_10S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,50.673,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R9_10M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,29.464,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R9_10H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,8.001,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R9_1S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,60.198,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R9_1M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,38.989,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R9_1H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,17.526,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R8_10S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,52.832,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R8_10M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,31.623,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R8_10H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,10.16,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R8_1S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,62.357,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R8_1M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,41.148,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R8_1H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,19.685,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R7_10S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,50.8,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R7_10M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,29.591,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R7_10H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,8.128,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R7_1S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,60.325,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R7_1M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,39.116,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R7_1H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,17.653,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R6_10S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,54.864,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R6_10M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,33.655,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R6_10H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,12.192,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R6_1S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,64.389,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R6_1M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,43.18,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R6_1H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,21.717,34.163,90,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R5_10S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,54.737,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R5_10M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,33.528,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R5_10H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,12.065,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R5_1S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,64.262,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R5_1M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,43.053,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R5_1H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,21.59,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R4_10S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,56.769,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R4_10M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,35.56,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R4_10H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,14.097,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R4_1S,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,66.294,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R4_1M,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,45.085,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R4_1H,220 Ohms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,23.622,52.705,270,"220 Ohms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-07220RL,,SMT
|
||||
R3,10 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,91.948,65.024,0,"10 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-0710KL,,SMT
|
||||
R2,10 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,73.66,57.404,180,"10 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-0710KL,,SMT
|
||||
R1,10 kOhms,TopLayer,PCB_-_RESISTOR_-_CHIP_-_RES_0603_1608,91.948,57.15,0,"10 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film",RC0603FR-0710KL,,SMT
|
||||
J1,PRPC003SAAN-RC,TopLayer,PCB_-_CONNECTOR_-_HEADER_-_MALE_1X3,59.436,85.725,180,Connector Header Through Hole 3 position 0.100" (2.54mm),PRPC003SAAN-RC,,TH
|
||||
D5,1N4007FL,TopLayer,FP-1N4007FL-MFG,91.059,62.611,180,Diode Gen Purp 1KV 1A SOD123FL,1N4007FL,,SMD
|
||||
D4,1N4007FL,TopLayer,FP-1N4007FL-MFG,39.751,84.328,0,Diode Gen Purp 1KV 1A SOD123FL,1N4007FL,,SMD
|
||||
D3,1N4007FL,TopLayer,FP-1N4007FL-MFG,74.549,59.817,0,Diode Gen Purp 1KV 1A SOD123FL,1N4007FL,,SMD
|
||||
D2,1N4007FL,TopLayer,FP-1N4007FL-MFG,18.262,84.455,0,Diode Gen Purp 1KV 1A SOD123FL,1N4007FL,,SMD
|
||||
D1,1N4007FL,TopLayer,FP-1N4007FL-MFG,91.059,59.563,180,Diode Gen Purp 1KV 1A SOD123FL,1N4007FL,,SMD
|
||||
C5,CC0603MRX5R7BB106,TopLayer,CAPC1608X90X40LL10T20,72.0993,81.803,270,10 µF ±20% 16V Ceramic Capacitor X5R 0603 (1608 Metric),CC0603MRX5R7BB106,,SMT
|
||||
C4,CC0603KRX7R8BB104,TopLayer,CAPC1608X90X40LL10T20,79.0643,76.596,180,0.1 µF ±10% 25V Ceramic Capacitor X7R 0603 (1608 Metric),CC0603KRX7R8BB104,,SM
|
||||
C3_HB,CC0603MRX5R7BB106,TopLayer,CAPC1608X90X40LL10T20,7.418,17.391,270,10 µF ±20% 16V Ceramic Capacitor X5R 0603 (1608 Metric),CC0603MRX5R7BB106,,SMT
|
||||
C3_MB,CC0603MRX5R7BB106,TopLayer,CAPC1608X90X40LL10T20,29.043,17.354,270,10 µF ±20% 16V Ceramic Capacitor X5R 0603 (1608 Metric),CC0603MRX5R7BB106,,SMT
|
||||
B1,92-AA,BottomLayer,92-AA,69.2067,23.241,0,AA Battery Holder,,92,THT
|
||||
L1,1239AS-H-4R7M=P2,TopLayer,FP-DFE252012C-MFG,82.626,10.033,270,"General Purpose Inductor, 4.7uH, 20%, 1 Element, Metal Alloy-Core, SMD, 1008 (2520)",1239AS-H-4R7M=P2,,SMD
|
||||
IC1,XC9140A501MR-G,TopLayer,TSOP95P280X130-6N,79.07,9.906,90,"Switching Regulator, Voltage-mode, PDSO5",XC9140A501MR-G,,SMD
|
||||
C1,CC0603MRX5R7BB106,TopLayer,CAPC1608X90X40LL10T20,76.403,9.966,270,10 µF ±20% 16V Ceramic Capacitor X5R 0603 (1608 Metric),CC0603MRX5R7BB106,,SMT
|
||||
C2,TMK107BBJ475KA-T,TopLayer,CAPC1608X90X40LL10T20,80.915,6.985,0,"Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X5R, 15% TC, 4.7uF, Surface Mount, 0603",TMK107BBJ475KA-T,,SMD
|
||||
|
Binary file not shown.
Binary file not shown.
Binary file not shown.
Binary file not shown.
Binary file not shown.
|
After Width: | Height: | Size: 48 KiB |
@ -0,0 +1,12 @@
|
||||
@online{cncKitchen2021,
|
||||
title = {Tips & Tricks for Heat-Set Inserts used in 3D printing},
|
||||
author = {Stefan Hermann},
|
||||
year = {2021},
|
||||
url = {https://www.cnckitchen.com/blog/tipps-amp-tricks-fr-gewindeeinstze-im-3d-druck-3awey}
|
||||
}
|
||||
|
||||
@online{hubsDesignRules,
|
||||
title = {Design Rules for 3D Printing},
|
||||
author = {Protolabs},
|
||||
url = {https://4075618.fs1.hubspotusercontent-na1.net/hubfs/4075618/002-003%203DP%20Rules%20Poster_Hubs_DEF.pdf}
|
||||
}
|
||||
Binary file not shown.
@ -0,0 +1,67 @@
|
||||
---
|
||||
title: ECE09402 Project 2C - PCB Enclosure
|
||||
author:
|
||||
- Aidan Sharpe
|
||||
- Karl Dyer
|
||||
- Michelle Frolio
|
||||
date: April 14th, 2025
|
||||
geometry: margin=1in
|
||||
bibliography: citations.bib
|
||||
---
|
||||
|
||||
\newpage
|
||||
|
||||
# Introduction
|
||||
Previously, we designed a digital clock circuit board. Its features included a six digit time display in HH:MM:SS format, oscillator calibration, and internal battery power. Notably, the circuit board had mounting holes to secure it in a final product. The goal of this portion of the project is to design and manufacture the enclosure for this final product.
|
||||
|
||||
# Design Requirements
|
||||
1. Enclosure geometry
|
||||
1. The enclosure shall have at least two mating pieces
|
||||
2. The enclosure shall meet IP30 specifications
|
||||
3. All parts shall be mechanically held together
|
||||
2. Enclosure safety
|
||||
1. The enclosure shall not have external sharp edges or pinch points
|
||||
2. The enclosure shall not expose any electrical connections
|
||||
3. Enclosure usability
|
||||
1. The digits shall be visible
|
||||
2. The colons between digits shall visible
|
||||
3. Hour and minute increment buttons shall accessible
|
||||
4. Batteries shall be accessible without complete disassembly
|
||||
5. Calibration potentiometer shall not be user accessible
|
||||
4. Manufacturing
|
||||
1. The enclosure shall be FDM 3D-printed.
|
||||
|
||||
# Results
|
||||
First, we imported our PCB design into SolidWorks 2025 using Altium MCAD CoDesigner. One of our design goals for the enclosure was to have the seven segment displays flush with the front face. We also decided that rather than standing the clock up, we wanted to lie the clock flat on a table. With this in mind, we decided to build a three-piece enclosure.
|
||||
|
||||
## Front Cover
|
||||
The first piece would cover the front of the PCB and also support it in the three corners with mounting holes. It accepts three M3x10mm screws and keeps the head flush with the top of the enclosure. The front cover also supports the front side of the PCB around its three mounting holes. The walls extend past the ends of the supports to cover the edges of the PCB. We wanted our parts to fit together closely but loosely, since we planned to use fasteners hold the enclosure together. We determined that a 0.5mm gap would allow for this fit [@hubsDesignRules].
|
||||
|
||||
|
||||
|
||||
## Back Cover
|
||||
The second piece would support the PCB from the back. Importantly, the supports had to be wide and deep enough to accept M3 heat set inserts, since we planned on screwing the two main pieces of the enclosure together through the PCB mounting holes. The hole dimensions required are a diameter of 4mm and a depth of 6.7mm [@cncKitchen2021]. We forgot to add one millimeter to the depth of the blind hole, so our holes were only 5.7mm deep. Additionally, we also to use this piece to cover the back except for where the batteries are located. This way, the user can access the batteries from the bottom.
|
||||
|
||||
|
||||
|
||||
|
||||
## Battery Cover
|
||||
The third piece, the battery cover, is not designed yet. In its current state, we plan to screw the back cover on using M3 screws and heat set inserts. The supports for the heat set inserts are already in place. Unfortunately, there are currently no M3 screws of the required length in stock at the ECE resource room, so we are holding off designing this portion.
|
||||
|
||||
## Slicing
|
||||
With both halves complete in the SolidWorks assembly, we saved each part as an STL mesh to import into OrcaSlicer. The parts were printed on our Creality Ender-3 Pro with a 0.4mm nozzle, 0.2mm layer height, and 15% cross hatch infill. The parts were oriented such that the large covering faces were flat on the baseplate, as this orientation minimized the amount of support material required as seen in figure \ref{fig:slicer}
|
||||
|
||||
|
||||
|
||||
## Printing
|
||||
After levelling the bed, the prints were started on our Ender-3 Pro with black Inland PLA+ filament. The estimated print time was a little over three hours. We ran into some levelling issues, and had to restart the print. Some issues still persisted, but we had confidence that the print would complete successfully, and it did. The only real issue was the less than ideal surface finish on the faces adhered to the print bed. The final parts are seen below:
|
||||
|
||||
|
||||
|
||||
# Reflection
|
||||
1. Measure twice, cut once! Double-check all critical dimensions **before** printing. In our case, we got lucky that the heat set inserts still went in and the screws did not bottom out.
|
||||
2. Plan ahead! When making the bottom cover for the enclosure, it became apparent that with a simple screw-on battery cover, would need shorter screws than were available in the resource center.
|
||||
3. Use test prints! After printing the bottom cover, we found that there was more support material than expected where the battery cover would go. Unfortunately, since the gap was so small, the support material was very difficult to remove.
|
||||
4. Don't rush! Since we printed on our Ender-3 Pro, we had to manually level the bed. We only had a small time window to level the bed, start the print, and make sure the first layer went down right. We rushed when levelling the bed to get the print started quickly, and our errors left a lot to be desired with the surface finish of the first layer. It might be worth investing in a auto-levelling probe.
|
||||
|
||||
# References
|
||||
Binary file not shown.
Binary file not shown.
|
After Width: | Height: | Size: 439 KiB |
Binary file not shown.
|
After Width: | Height: | Size: 57 KiB |
Binary file not shown.
|
After Width: | Height: | Size: 268 KiB |
Binary file not shown.
Binary file not shown.
|
After Width: | Height: | Size: 103 KiB |
@ -0,0 +1,54 @@
|
||||
import numpy as np
|
||||
import scipy as sp
|
||||
import matplotlib.pyplot as plt
|
||||
|
||||
|
||||
def main():
|
||||
head_err_0 = np.radians(30)
|
||||
path_angle_0 = np.radians(20)
|
||||
line_sight_0 = head_err_0 - path_angle_0
|
||||
range_0 = 20E3
|
||||
z_f = 0
|
||||
x_f = 0
|
||||
|
||||
K = np.array([3,4,5])
|
||||
|
||||
tau = np.linspace(0,1,50)
|
||||
|
||||
for k in K:
|
||||
head_err = head_err_0 * tau**(k-1)
|
||||
line_sight = line_sight_0 + head_err_0*(1 - tau**(k-1))/(k-1)
|
||||
path_angle = head_err - line_sight
|
||||
|
||||
z = -line_sight_0 + tau*line_sight
|
||||
x = 1 - tau
|
||||
|
||||
plt.subplot(321)
|
||||
plt.plot(tau, np.degrees(head_err), label=f"K = {k}")
|
||||
plt.title("Heading Error")
|
||||
|
||||
plt.subplot(323)
|
||||
plt.plot(tau, np.degrees(path_angle), label=f"K = {k}")
|
||||
plt.title("Path Angle")
|
||||
|
||||
plt.subplot(325)
|
||||
plt.plot(tau, np.degrees(line_sight), label=f"K = {k}")
|
||||
plt.title("Line of Sight")
|
||||
|
||||
plt.subplot(322)
|
||||
plt.plot(tau, z, label=f"K = {k}")
|
||||
plt.title("Altitude Difference")
|
||||
|
||||
plt.subplot(324)
|
||||
plt.plot(tau, x, label=f"K = {k}")
|
||||
plt.title("Horizontal Distance")
|
||||
|
||||
plt.subplot(326)
|
||||
plt.plot(tau, (x**2 + z**2)**0.5, label=f"K = {k}")
|
||||
plt.title("Trajectory")
|
||||
|
||||
plt.show()
|
||||
|
||||
|
||||
if __name__ == "__main__":
|
||||
main()
|
||||
Loading…
Reference in New Issue
Block a user